Philips Components Surface mounted ceramic multilayer capacitors General data PACKAGING General information Tape on reel For the combination carrier/cover tape no electrostatic behaviour is observed (relative humidity 30%). The products do not stick to the cover tape. Packaging conforms fully with "IEC 286-3", "EIA 481-1" and "JIS C0806" industrial standards. The technical and thermal properties of polycarbonate tapes are excellent, so there is no change in dimensions as a function of time. The peel off force is very stable as a function of time and temperature, and it is defined as 0.1 to 0.7 N at a peel-off speed of 120 mm/minute. Ceramic Multilayer Capacitors are supplied on tape on reel or in bulk case. For CMCs with a product thickness of <1 mm, paper tape is preferred. CMCs with a product thickness of 1 mm, are supplied in embossed blister tape. CARRIER TAPE Bulk packaging Polycarbonate. Table 1 For bulk case; see Fig.5 and Table 7. Properties of carrier tape Environmental considerations WIDTH PARAMETER Thickness 8.1 0.2 mm * Cover tape, carrier tape and reel do not contain the environmentally-harmful PVC materials. 12 0.2 mm * Because the carrier tape is made of a homogeneous material (so called mono-plastic), it is ideally suited for recycling. 190 to 280 m 240 20 m Tensile strength at break >60 N/mm2 >60 N/mm2 Elongation at break 100 to 150% 100 to 150% Surface resistance >1012 /sq. * Compared to other PVC-free materials polycarbonate shows very little deformation as a function of temperature and has excellent stiffness. >1012 /sq. COVER TAPE Polyester (antistatic). Table 2 Properties of cover tape WIDTH PARAMETER 5.5 0.1 mm 9.5 0.1 mm Breaking force 10.7 N 17.6 N Elongation at break 63% 63% Surface resistance <1010 Softening point 71 5 C 71 5 C Thickness 62 m 62 m 1997 Jul 30 /sq. <1010 /sq. 1 Philips Components Surface mounted ceramic multilayer capacitors General data Blister tape specifications handbook, full pagewidth K 0 P0 D0 T P2 E F cover tape W B0 MBG516 A0 T1 D1 T2 P1 direction of unreeling K0: so chosen that the orientation of the component cannot change. For W = 8 mm: T2 = 2.5 mm max. For W = 12 mm: T2 = 4.5 mm max. For dimensions see Table 3. Fig.1 Blister tape. Table 3 Dimensions of blister tape for relevant product size code; see Fig.1 PRODUCT SIZE CODE 0603 0805 1206 1210 1812 2220 TOLERANCE (mm) A0 nominal clearance; note 1 0.15 0.20 0.30 0.30 0.40 0.40 - B0 nominal clearance; note 1 0.15 0.20 0.30 0.30 0.40 0.40 - DIMENSION K0 minimum clearance; note 1 0.05 0.05 0.05 0.05 W 8.1 8.1 8.1 8.1 E 1.75 1.75 1.75 1.75 0.05 12.0 1.75 0.05 12.0 1.75 - 0.2 0.1 F 3.5 3.5 3.5 3.5 5.5 5.5 0.05 D0 1.5 1.5 1.5 1.5 1.5 1.5 +0.1/-0.0 D1 - 1.5 1.5 +0.1/-0.0 1 1 1 P0; note 2 4 4 4 4 4 4 0.1 P1 4 4 4 4 8 8 0.1 P2 2 2 2 2 2 2 0.05 Notes 1. Typical capacitor displacement in pocket. 2. P0 pitch tolerance over any 10 pitches is 0.2 mm. 1997 Jul 30 2 Philips Components Surface mounted ceramic multilayer capacitors General data Paper tape specifications P0 andbook, full pagewidth D0 T P2 E F cover tape W B0 MBG251 A0 P1 For dimensions see Table 4. Fig.2 Paper tape. Table 4 Dimensions of paper tape for relevant product size; see Fig.2 PRODUCT SIZE CODE SYMBOL 0402 0603 0805 1206 UNIT SIZE TOL. SIZE TOL. SIZE TOL. SIZE A0 0.62 0.05 1.10 0.05 1.65 0.05 2.0 0.1 mm B0 1.12 0.05 1.90 0.05 2.40 0.05 3.5 0.1 mm W 8.0 0.2 8.0 0.2 8.0 0.2 8.0 0.2 mm E 1.75 0.1 1.75 0.1 1.75 0.1 1.75 0.1 mm F 3.5 0.05 3.5 0.05 3.5 0.05 3.5 0.05 mm D0 1.5 +0.1/-0 1.5 +0.1/-0 1.5 +0.1/-0 1.5 +0.1/-0 mm P0; note 1 4 0.05 4 0.05 4 0.05 4 0.05 mm P1 2 0.05 4 0.1 4 0.1 4 0.1 mm P2 2 0.05 2 0.05 2 0.05 2 0.05 mm Tmax 0.6 0.05 1.0 0.05 1.0 0.05 1.0 0.05 mm Note 1. P0 pitch tolerance over any 10 pitches is 0.2 mm. 1997 Jul 30 3 TOL. Philips Components Surface mounted ceramic multilayer capacitors General data Reel specifications W2 handbook, full pagewidth 20.5 12.75 0.15 N 0 A MSA284 W1 Dimensions in mm. Fig.3 Reel. Table 5 Reel dimensions; see Fig.3 TAPE WIDTH (mm) A (mm) N (mm) W1 (mm) W2 MAX. (mm) 8 180 62 1.5 8.4 +1.5/-0.0 14.4 8 330 62 1.5 8.4 +1.5/-0.0 14.4 12 180 62 1.5 Properties of reel Material: polystyrene Surface resistance: <1010 /sq. 1997 Jul 30 4 12.4 +2/-0.0 18.4 Philips Components Surface mounted ceramic multilayer capacitors General data Leader/trailer tape specification leader end cover tape only empty compartments with cover tape trailer end trailer (max. 260 mm) leader 120 40 mm 400 mm MEA529 - 2 Fig.4 Leader/trailer tape. Table 6 Leader/trailer tape data DESCRIPTION VALUE Minimum length of empty compartments at leader end 400 mm of which a minimum 240 mm of empty compartments are covered with cover tape and 120 40 mm cover tape only. Minimum length of empty compartments at trailer end 1997 Jul 30 208 mm or 260 mm. If the length is 260 mm an extra product is placed at 208 mm to mark this position. 5 Philips Components Surface mounted ceramic multilayer capacitors Bulk case specification General data Table 7 Packaging quantities for component size; see note 1 and Fig.5 Features and benefits: * Reduced costs DIMENSIONS OF CAPACITOR (mm) SIZE CODE - Storage L1 W T QUANTITY - Transport 0402 1.0 0.5 0.5 50000 - Machine handling 0603 1.6 0.8 0.8 15000 - Packaging 0805 2.0 1.25 0.6 10000 0805 2.0 1.25 0.9 8000 0805 2.0 1.25 1.25 5000 * Customized labelling (bar codes). Note 1. Refer to the selection charts in product data for specific values. handbook, 4 columns slider shutter coupled portion MGB377 Fig.5 Bulk case outline. 1997 Jul 30 6 Philips Components Surface mounted ceramic multilayer capacitors Multi-pack box specification General data Table 8 Features and benefits: Number of reels per box; see Fig.6 QUANTITY PER BOX * Minimum recycling costs REEL SIZE (mm) TAPE SIZE (mm) MIN. MAX. * Maximum environmental friendliness 180 8 5 25 12 5 10 8 5 15 * Reduced handling time 330 * Economic usage of packaging * Customized labelling (bar codes). handbook, full pagewidth BATCH 0012345678 5000 A670 RS 9238 1B CG 55/125/56 ESR-Q 1206J 330p + / -5% 63V CUSTOMER 174024 9023456 BATCH ORIG A670 RPC RS QTY 6X4000 DATA 9334 TYPE 1206CG331J9BB CODENO Philips Components Philips Components PHILIPS 1206 TC700 LRC01 0R14 5% MADE IN HOLLAND CODENO 2222 724 98002 2222 863 15331 end cap adhesive tape MLB672 Fig.6 Multi-pack box outline. 1997 Jul 30 7 tape-on-reel Philips Components Surface mounted ceramic multilayer capacitors General data LABELLING Label examples are shown in Figs 7 and 8 (bar code according to EN 800 code 39). handbook, full pagewidth LINE MARKING EXPLANATION 1. 2. 3. 1. Country of origin 2. Material code and climatic category 3. Size, termination code, value, tolerance and rated voltage 4. Unique batch number 5. Country of origin in code: A670 is Holland 6. Quantity and production period, year and week code 7. 15-digit code 8. Catalogue number (12NC) 4. 5. 6. 7. 8. CCA601 Fig.7 Packaging label (example). handbook, full pagewidth LINE MARKING EXPLANATION 1. 2. 3. 4. 5. 6. 1. Unique batch number 2. Quantity and date code 3. Material code and climatic category 4. Size, termination code, value, tolerance and rated voltage 5. 15-digit code 6. Catalogue number (12NC) CCA602 Fig.8 Reel label (example). 1997 Jul 30 8 Philips Components Surface mounted ceramic multilayer capacitors General data METHOD OF MOUNTING AND DIMENSIONS OF SOLDER LANDS An improper combination of soldering, substrate and chip size can lead to a damaging of the component. The risk increases with the chip size and with temperature fluctuations (>100 C). Therefore, it is advised to use the smallest possible size and follow the dimensional recommendations given in Tables 9 and 10 for reflow and wave soldering. More detailed information is available on request. For normal use the capacitors may be mounted on printed-circuit boards or ceramic substrates by applying wave soldering, reflow soldering (including vapour phase soldering) or conductive adhesive in accordance with CECC 00802 classification A. For advised soldering profiles see Figs 9, 10 and 11. 300 MLA859 10 s T 260 C (C) 245 C 250 10 s 215 C 200 180 C 150 40 s 130 C 100 2 K/s 50 0 0 50 100 150 200 250 t (s) Typical values (solid line). Process limits (dotted lines). Fig.9 Reflow soldering. 1997 Jul 30 9 Philips Components Surface mounted ceramic multilayer capacitors General data 300 10 s T MLA861 (C) 235 C to 260 C 250 200 second wave 5 K/s first wave 2 K/s 200 K/s 150 100 C to 130 C forced cooling 100 2 K/s 50 0 0 50 100 150 200 250 t (s) Typical values (solid line). Process limits (dotted lines). The capacitors may be soldered twice in accordance with this method if desired. Fig.10 Double wave soldering. 300 MLA860 T (C) 250 20 to 40 s 215 C 200 180 C 150 forced cooling 130 C external preheating 100 C 100 internal preheating, e.g. by infrared, max. 2 K/s 50 0 0 50 100 150 200 250 t (s) Typical values (solid line). Process limits (dotted line). Fig.11 Vapour phase soldering. 1997 Jul 30 10 Philips Components , ,, z| y |, , y { ,, , { z Surface mounted ceramic multilayer capacitors General data D E C B A F E = available track area under the CMC. G preferred direction during wave soldering solder land / solder paste pattern solder resist pattern | occupied area tracks CCA045 Fig.12 Recommended dimensions of solder lands. Table 9 Reflow soldering; for dimensions also see Fig.12 FOOTPRINT DIMENSIONS (mm) SIZE CODE PROCESSING REMARKS PLACEMENT ACCURACY (mm) A B C D E F G 0402 1.5 0.5 0.5 0.5 0.10 1.75 0.95 0.15 0603 2.3 0.7 0.8 0.9 0.26 2.7 1.5 0.15 0603 2.3 0.5 0.9 0.9 0.0 2.7 1.5 IR or hot plate soldering 0.25 0.25 0805 2.8 0.9 0.95 1.4 0.45 3.2 2.1 1206 4.0 2.0 1.0 1.8 1.4 4.4 2.5 0.25 1210 4.0 2.0 1.0 2.7 1.4 4.4 3.4 0.25 1808 5.4 3.3 1.05 2.3 2.7 5.8 2.9 1812 5.4 3.3 1.05 3.5 2.7 5.8 4.1 2220 6.6 4.5 1.05 5.3 3.9 7.0 5.9 0.25 ceramic substrate only 0.25 0.25 Table 10 Wave soldering (no dummy tracks allowed for 500 V); for dimensions also see Fig.12 FOOTPRINT DIMENSIONS (mm) A B C D E F G PROPOSED NUMBER AND DIMENSIONS OF DUMMY TRACKS (mm) 2.4 1.0 0.7 0.8 0.2 3.0 1.9 1 x (0.2 x 0.8) SIZE CODE 0603 PLACEMENT ACCURACY (mm) 0.10 0603 2.7 0.9 0.9 0.8 0.0 3.2 2.1 1 x (0.3 x 0.8) 0.25 0805 3.2 1.4 0.9 1.3 0.36 4.1 2.5 1 x (0.3 x 1.3) 0.15 0805 3.4 1.3 1.05 1.3 0.2 4.3 2.7 1 x (0.2 x 1.3) 0.25 1206 4.8 2.3 1.25 1.7 1.25 5.9 3.2 3 x (0.25 x 1.7) 0.25 1210 5.3 2.3 1.5 2.6 1.25 6.3 4.2 3 x (0.25 x 2.6) 0.25 1997 Jul 30 11 Philips Components Surface mounted ceramic multilayer capacitors General data TEST CONDITIONS IN STATIC SOLDER BATH PARAMETER DESCRIPTION Solderability 95% covered with smooth and bright solder coating CECC requirement: 235 5 C for 2 0.5 s IEC requirement: 215 3 C for 3 0.3 s Resistance to leaching 10% of the metallization of the edges of the head face may be missing (inner electrodes are not visible) C/C class 1: 0.5% or 0.5 pF and C/C class 2: >-5% and 10% 260 5 C for 30 1 s MEA612 260 T o ( C) LEACHING (DISSOLUTION 10 %) 240 220 NO LEACHING 200 0 100 200 300 400 500 t (s) For NiSn metallized terminations, the leaching resistance is a factor of 10 times better than shown in the graph. Fig.13 Resistance to leaching of AgPd metallized terminations (in static solder bath) at various temperatures. 1997 Jul 30 12 Philips Components Surface mounted ceramic multilayer capacitors General data TESTS AND REQUIREMENTS Table 11 Test procedures and requirements IEC 384-10/ IEC 68-2 CECC 32 100 TEST CLAUSE METHOD TEST PROCEDURE REQUIREMENTS 4.4 mounting the capacitors may be mounted no visible damage on printed-circuit boards or ceramic substrates by applying wave soldering, reflow soldering (including vapour phase soldering) or conductive adhesive 4.5 visual inspection and any applicable method using x10 dimension check magnification in accordance with specification 4.6.1 capacitance within specified tolerance class 1: C 1000 pF, f = 1 MHz; C > 1000 pF, f = 1 kHz; NP0: measuring voltage 1 V at 20 C class 2: for all capacitors f = 1 kHz; X7R: measuring voltage 1 V at 20 C Y5V/Z5U: measuring voltage 1 V at 25 C 4.6.2 tan class 1: C 1000 pF, f = 1 MHz; C > 1000 pF, f = 1 kHz; NP0: measuring voltage 1 V at 20 C in accordance with specification class 2: for all capacitors f = 1 kHz; X7R: measuring voltage 1 V at 20 C Y5V/Z5U: measuring voltage 1 V at 25 C 4.6.3 insulation resistance at UR (DC) for 1 minute 4.6.4 voltage proof UR 100 V: 2.5 x UR for 1 minute; UR > 100 V: 1.5 x UR +100 for 1 minute no breakdown or flashover 4.7.1 temperature coefficient class 1: between minimum and maximum temperature in accordance with specification 4.7.2 temperature characteristic class 2: between minimum and maximum temperature in accordance with specification 4.8 adhesion a force of 5 N applied for 10 s to the line joining the terminations and in a plane parallel to the substrate no visible damage 1997 Jul 30 13 in accordance with specification Philips Components Surface mounted ceramic multilayer capacitors IEC 384-10/ IEC 68-2 CECC 32 100 TEST CLAUSE METHOD 4.9 4.10 TEST bond strength of plating on end face Tb resistance to soldering heat General data PROCEDURE REQUIREMENTS mounted in accordance with CECC 32 100, paragraph 4.4 no visible damage conditions: bending 1 mm at a rate of 1 mm/s, radius jig. 340 mm C/C: class 1: 1% class 2, X7R: 10% class 2, Y5V: 20% 260 5 C for 10 0.5 s in a static solder bath the terminations shall be well tinned after recovery C/C: class 1: 0.5% or 0.5 pF whichever is greater class 2, X7R: >-5% and 10% class 2, Y5V: >-10% and 20% resistance to leaching 260 5 C for 30 1 s in a static solder bath using visual enlargement of x10, dissolution of the terminations shall not exceed 10% 4.11 Ta solderability zero hour test, and test after storage (20 to 24 months) in original packing in normal atmosphere; unmounted chips completely immersed for 2 0.5 s in a solder bath at 235 5 C the terminations shall be well tinned 4.12 Na rapid change of temperature preconditioning, class 2 only: NP0/X7R: -55 to +125 C; 5 cycles Y5V: -25 to +85 C; 5 cycles no visible damage after 24 hours recovery 1997 Jul 30 14 C/C: class 1: 1% or 1 pF class 2, X7R: 15% class 2, Y5V: 20% Philips Components Surface mounted ceramic multilayer capacitors IEC 384-10/ IEC 68-2 CECC 32 100 TEST CLAUSE METHOD 4.14 Ca TEST damp heat, steady state General data PROCEDURE preconditioning, class 2 only: 56 days at 40 C; 90 to 95% RH; UR applied REQUIREMENTS no visual damage after recovery class 1: 1 to 2 hours class 2: 24 hours C/C: class 1: 2% or 1 pF, whichever is greater class 2, X7R: 15% class 2, Y5V: 30% tan : class 1: 2 x specified value class 2: 7% Rins: class 1: 2500 M or RiCR 25 s, whichever is less class 2: 1000 M or RiCR 25 s, whichever is less 4.15 endurance preconditioning, class 2 only: 1000 hours at upper category temperature at: 2 x UR for UR = 50 V; 1.5 x UR for other rated voltages no visible damage after 24 hours recovery: C/C: class 1: 2% or 1 pF, whichever is greater class 2, X7R: 20% class 2, Y5V: 30% tan : class 1: 2 x specified value class 2: 7% Rins: class 1: 4000 M or RiCR 40 s, whichever is less class 2: 2 000 M or RiCR 50 s, whichever is less CECC 32101 - 801 1997 Jul 30 damp heat accelerated, steady state 85 C; 85% RH; 500 hours with bias 1.5 V and UR 15 Rins shall not be less than 10% of the initial requirements